IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

Name:
IEC/PAS 60191-6-19 Ed. 1.0 en:2008 PDF

Published Date:
01/22/2008

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Edition :	1.0
File Size :	1 file , 1.1 MB
Note :	This product is unavailable in Canada
Number of Pages :	22
Published :	01/22/2008

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